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The effects of size and strain on the electronic behavior of AlN/GaN heterojunction

Qianjin Lei1*

1 School of aeronautics and astronautics, Zhejiang University, China

* Corresponding authors emails: qj_lei@zju.edu.cn
DOI10.24435/materialscloud:32-q6 [version v1]

Publication date: Nov 20, 2024

How to cite this record

Qianjin Lei, The effects of size and strain on the electronic behavior of AlN/GaN heterojunction, Materials Cloud Archive 2024.184 (2024), https://doi.org/10.24435/materialscloud:32-q6

Description

The electronic behavior of AlN/GaN heterojunction is investigated at thicknesses of 1.2~4.2 nm and biaxial strain of -8%~8% based on density functional theory. The structural stability, charge distribution, electronic properties, and transport properties of the cells reveal the enhancing effects of size and strain. With the thickness decreases, the bandgap values of the cells, as low as -0.387 eV, confirm the transition in structural nature, while the individual atomic layers remain bandgaps of at least 0.3 eV in DOS. The carrier mobility enhances to 2×1012 m2/V/s. The cell with 1.2 nm thickness is weakened by 50% due to the quantum confinement effect. Under compressive strain ranging from -8% to 0%, the characteristics of heterojunctions are enhanced by an order of magnitude, in contrast, under 0%~8% tensile strain, the cells decrease slightly but for 2L cells.

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File name Size Description
Readme.txt
MD5md5:1ea8f25ac1594a759c138e7ac65e45a8
1.5 KiB Readme
AlNGaN Manuscript.zip
MD5md5:319730280f3ed11cfe04e0e254b7ca73
185.1 MiB All the data in this work

License

Files and data are licensed under the terms of the following license: Creative Commons Attribution Non Commercial 4.0 International.
Metadata, except for email addresses, are licensed under the Creative Commons Attribution Share-Alike 4.0 International license.

External references

Journal reference
Q. Lei, PHYSICAL CHEMISTRY CHEMICAL PHYSICS. (submitted)

Keywords

BandGap Heterojunction strain

Version history:

2024.184 (version v1) [This version] Nov 20, 2024 DOI10.24435/materialscloud:32-q6